Hi everybody I FOUND THE SOLUTION, i hope that i will write corect in english, i own a galaxy a53 5g 256GB internal storage, my phone is out of warranty. The phone starded two monts ago to freze the scren, sometimes a pixel line appear and sometimes even made a strange sound for maybe 10 second than restart. So i started to search te problem. The problem is that the solder that keeps CPU glued to the motherboard cracks at microscopic level, and when you use the phone and cpu is hot dilates and is not making contact and the phone crash. The solution is to "reball the cpu" this procedure can be made by somebody that fix phones, you can find many videos on youtube. But I can't find somebody to do this "cpu reball" in my area. So i was thinking that if i will borrow a hot blower from a friend, theardown the phone and heat the cpu until the soder wil melt the bad tiny contact that is imperfect betweent cpu and motherboard will reglue back. So i set the air blower on 380°C on the step 3. Heat the CPU for maybe 40 seconds until the soder melt, than i stoped and wait 5 minutes for the motherboard to cool down, WITHOUT MOVING OR TOUCHING THE MOTHER BOARD, i assembled everything back And now the phone works perfectly.
WARNIG: in youtube videos they remove the cpu from mother board, put fresh soder and glue the cpu back. I DIDN'T MADE THAT PROCESS. ALL I DID WAS TO HEAT TE CPU UNTIL I SAW THE SODER MELTING, AND THAN I STOPED AND DIDN'T TOUCHED OR MOVED THE MOTHERBOARD FOR 5 MINUTES UNTIL IT COOLED DOWN. SO IF YOU HEAT THE CPU DON'T TOUCH IT, YOU JUST WANT THAT SODER TO MELT SO THE TINI PIN FROM CPU SPOT THAT IS NOT CONECTED WELL ON THE MOTHERBOARD TO RECONECT.
IF YOU DON'T FIND SOMEBODY SPECIALIZED TO DO THOS JOB YOU DO IT ON YOUR OWN RISK.