crwdns2933423:0crwdne2933423:0
crwdns2918538:0crwdne2918538:0

crwdns2934243:0crwdne2934243:0 MakerBuddy

crwdns2934249:0crwdne2934249:0:

-MOSFETS got a high surface that allows to dissipate the temperature. That process will be tricky also because of usage of non-PB solder. 380C set would be ~330-340 effective heat on the component, which is barely enough to solder, and way to low for desoldering such heat dissipating element. Be careful thou, because glass-resin PCBs likes to boil at higher temps, which is deadly for multi-layer ones like in laptops. Consider pre-heating whole PCB with a heatbed or just the area around the component.
+MOSFETS got a high surface that allows to dissipate the temperature. That process will be tricky also because of usage of non-PB solder. 380C set would be ~330-340 effective heat on the component, which is barely enough to solder, and way to low for desoldering such heat dissipating element. Be careful thou, because glass-resin PCBs likes to boil at higher temps, which is deadly for multi-layer ones like in laptops. Consider pre-heating whole PCB with a heatbed or just the area around the component with air gun.
What I would do:
# Lots of lots of flux.
# Add solder tin with PB using your iron to lower the melting temperature - especially at the gate/ground/NC-radiator-pin (whatever it is the largest surface)
# Take away most of the tin
# Reapply flux. Lots.
# Heat it up with air ~400-420 should be fine if you would be fast.
-
Good luck!

crwdns2915684:0crwdne2915684:0:

open

crwdns2934241:0crwdne2934241:0 MakerBuddy

crwdns2934249:0crwdne2934249:0:

MOSFETS got a high surface that allows to dissipate the temperature. That process will be tricky also because of usage of non-PB solder. 380C set would be ~330-340 effective heat on the component, which is barely enough to solder, and way to low for desoldering such heat dissipating element. Be careful thou, because glass-resin PCBs likes to boil at higher temps, which is deadly for multi-layer ones like in laptops. Consider pre-heating whole PCB with a heatbed or just the area around the component.

What I would do:

# Lots of lots of flux.
# Add solder tin with PB using your iron to lower the melting temperature - especially at the gate/ground/NC-radiator-pin (whatever it is the largest surface)
# Take away most of the tin
# Reapply flux. Lots.
# Heat it up with air ~400-420 should be fine if you would be fast.

Good luck!

crwdns2915684:0crwdne2915684:0:

open