Based on the specific issues here, and the number of them, I suspect you've got an issue with separation between the two boards. It sounds like this has been mentioned in the comments already, but just for sake of clarity and some added info.
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The WiFi chip is likely okay, The problem here sounds more likely that it cannot talk to the CPU or other components on the top board. This may also be the case with touch and Audio.
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All of these functions have lines that run between the two boards. In fact they all have lines which run along the bottom edge of the top board, which is especially prone to separation issues.
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The WiFi chip is likely okay, The problem here sounds more likely that it cannot talk to the CPU or other components on the top board. This may also be the case with touch and Audio. All of these functions have lines that run between the two boards. In fact they all have lines which run along the bottom edge of the top board, which is especially prone to separation issues.
If the phone has experienced a heavy drop, or even just with the repeat flexion of everyday use, some of the solder connections separate. Many times the solder pads actually tear off the board altogether, leaving a tiny nubbin of a trace. See the included picture from an iPhone 12 where you can clearly see the spots where the copper traces should have attached to the solder pad. The force to tear the pad off these tiny copper lines is much less than to break the actual solder joint in most cases.
Based on the specific issues here, and the number of them, I suspect you've got an issue with separation between the two boards. It sounds like this has been mentioned in the comments already, but just for sake of clarity and some added info.
The WiFi chip is likely okay, The problem here sounds more likely that it cannot talk to the CPU or other components on the top board. This may also be the case with touch and Audio.
All of these functions have lines that run between the two boards. In fact they all have lines which run along the bottom edge of the top board, which is especially prone to separation issues.
If the phone has experienced a heavy drop, or even just with the repeat flexion of everyday use, some of the solder connections separate. Many times the solder pads actually tear off the board altogether, leaving a tiny nubbin of a trace. See the included picture from an iPhone 12 where you can clearly see the spots where the copper traces should have attached to the solder pad. The force to tear the pad off these tiny copper lines is much less than to break the actual solder joint in most cases.
[image|2759872]