crwdns2934241:0crwdne2934241:0 Ben

crwdns2934249:0crwdne2934249:0:

That is underfill near the components. They are generally used around and under BGA (Ball-Grid-Array) chips so that the logic board has any flex / shock it decreases the chances of these solder balls under the chip from cracking / disconnecting from the board.

They also help protect against any water ingress going under the chips too.

crwdns2915684:0crwdne2915684:0:

open