error1 are one of the hardest problems to repair. As you already stated correctly the problem is most likely the baseband chips. You can not replace those, and damaging them with heat makes the whole phone useless. Why ? Apple tied different IC's together (NAND, Baseband, BB CPU) damaging one, means replacing all 3 of those which will end up in an phone you can only use for parts, when repairing waterdamaged phones.
Most error 1 are caused by waterdamage (which you excluded) and by drops. So why not reflow ? 9 out of 10 reflows might end up worse than they were before you reflowed it. Its not like on a xbox or playstion where you heat a chip and hope the solder will melt and reastablish the connection with the board (not a good repair btw).
Baseband IC'S are also glued, which will make any reflow of them useless.
IF the reason for your baseband erorr is the baseband IC, then you would have to remove it entirely, remove all glue from board and IC, reball that IC and resolder it. This is not easy especially if you do this for the first time. Even then, there is no guarantee that it will be fixed.
So What to do ? You decide !
Me personally, I hate it when I see this error.
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=== Update ===
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Apple links many parts inside on a phone. It is getting more complicated every time a new phone is beeing released making repairs harder and even some day impossible. the baseband of every phone is linked to other and reprogramming is not possible to my knowledge. I heard of a chineese group who was able to change the serial number of a phone, if true. It seems possible. But that is far beyond my reach since noone made it public.
error1 are one of the hardest problems to repair. As you already stated correctly the problem is most likely the baseband chips. You can not replace those, and damaging them with heat makes the whole phone useless. Why ? Apple tied different IC's together (NAND, Baseband, BB CPU) damaging one, means replacing all 3 of those which will end an phone you can only use for parts, when repairing waterdamaged phones.
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error1 are one of the hardest problems to repair. As you already stated correctly the problem is most likely the baseband chips. You can not replace those, and damaging them with heat makes the whole phone useless. Why ? Apple tied different IC's together (NAND, Baseband, BB CPU) damaging one, means replacing all 3 of those which will end up in an phone you can only use for parts, when repairing waterdamaged phones.
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Most error 1 are caused by waterdamage (which you excluded) and by drops. So why not reflow ? 9 out of 10 reflows might end worse than they where before. Its not like on a xbox or playstion where you heat a chip and hope the solder will melt and reastablish the connection with the board (not a good repair btw).
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Most error 1 are caused by waterdamage (which you excluded) and by drops. So why not reflow ? 9 out of 10 reflows might end up worse than they were before you reflowed it. Its not like on a xbox or playstion where you heat a chip and hope the solder will melt and reastablish the connection with the board (not a good repair btw).
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Baseband IC'S (to my knowledge) are also glued, which will make any reflow of them useless.
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Baseband IC'S are also glued, which will make any reflow of them useless.
IF the reason for your baseband erorr is the baseband IC, then you would have to remove it entirely, remove all glue from board and IC, reball that IC and resolder it. This is not easy especially if you do this for the first time. Even then, there is no guarantee that it will be fixed.
Hey Josh,
you will not like my answear but here it comes:
error1 are one of the hardest problems to repair. As you already stated correctly the problem is most likely the baseband chips. You can not replace those, and damaging them with heat makes the whole phone useless. Why ? Apple tied different IC's together (NAND, Baseband, BB CPU) damaging one, means replacing all 3 of those which will end an phone you can only use for parts, when repairing waterdamaged phones.
Most error 1 are caused by waterdamage (which you excluded) and by drops. So why not reflow ? 9 out of 10 reflows might end worse than they where before. Its not like on a xbox or playstion where you heat a chip and hope the solder will melt and reastablish the connection with the board (not a good repair btw).
Baseband IC'S (to my knowledge) are also glued, which will make any reflow of them useless.
IF the reason for your baseband erorr is the baseband IC, then you would have to remove it entirely, remove all glue from board and IC, reball that IC and resolder it. This is not easy especially if you do this for the first time. Even then, there is no guarantee that it will be fixed.
So What to do ? You decide !
Me personally, I hate it when I see this error.