Hello ifixit!
Ive been plagued forever by iTunes error #1 and have decided its time to learn how to fix it, or at least attempt to. I have a stack of iPhone 5c's on my desk that all give error #1 at about 75% way through the restore. These particular devices are not water damaged. Some of them will come on, but will not restore. Most of them show an apple logo for about 5-10 seconds and then they shut themselves off.
I've heard a lot about reflowing/reballing the baseband chip(or nand chip) but I can't find too many specifics about it. I'm new to the reflow scene in all together, with only a few successful reflows. Is this the right direction to head for error #1? I have a heat gun, a soldering iron, a toaster oven, and an IR BGA rework station. I've seen so many different methods, I'm just not sure what would be most successful. Any help with the specifics on what max temperature should be on an iPhone PCB and length of time would be appreciated.
Also, is something like reflowing a baseband chip an actual fix? Or should I be replacing these components all together? I don't want to put a bandaid over an issue that comes back 2 weeks later in the customers hands.
And to note, I have tried reflowing 3 of these baseband chips on error #1 phones with no success. 2 of them did not change all, I used kapton tape to cover what shouldn't be heated, and used the low setting on my heat gun for about 60 seconds. The other phone, I used the high heat setting for 60 seconds, and well, that phone doesn't do much now.
Any help at all is greatly appreciated!
Hello ifixit!
Ive been plagued forever by iTunes error #1 and have decided its time to learn how to fix it, or at least attempt to. I have a stack of iPhone 5c's on my desk that all give error #1 at about 75% way through the restore. These particular devices are not water damaged. Some of them will come on, but will not restore. Most of them show an apple logo for about 5-10 seconds and then they shut themselves off.
I've heard a lot about reflowing/reballing the baseband chip(or nand chip) but I can't find too many specifics about it. I'm new to the reflow scene in all together, with only a few successful reflows. Is this the right direction to head for error #1? I have a heat gun, a soldering iron, a toaster oven, and an IR BGA rework station. I've seen so many different methods, I'm just not sure what would be most successful. Any help with the specifics on what max temperature should be on an iPhone PCB and length of time would be appreciated.
Also, is something like reflowing a baseband chip an actual fix? Or should I be replacing these components all together? I don't want to put a bandaid over an issue that comes back 2 weeks later in the customers hands.
And to note, I have tried reflowing 3 of these baseband chips on error #1 phones with no success. 2 of them did not change all, I used kapton tape to cover what shouldn't be heated, and used the low setting on my heat gun for about 60 seconds. The other phone, I used the high heat setting for 60 seconds, and well, that phone doesn't do much now.
Any help at all is greatly appreciated!