I'm updating this answer--at this point (Summer 2014) I've repaired something like 50-100 phones with pry damage.
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Lots of people have this exact pry damage---it is fairly straightforward to replace if you're set up for microsoldering
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If you don't want to send out to have the repair done, then here are a couple of pieces of advice.
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1.) About half of the time people underestimate the damage that is actually on the board--before you go order your parts, probe each tiny component with a small needle. Many times they are pushed up off their solder pads and will have to be replaced. An intact component will not move if probed with a needle.
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2.) Even if you have your components that were pried off the board, 90% of the time they are damaged themselves. Especially the bottom two pads of U3---this one must have all 6 pads intact.
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3.) If you have lost the bottom pad on Q3 or Q7 don't bother replacing it.
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4.) The phone will work fine without DZ101_RF, however if you place this component incorrectly, you'll have a SIM recognition problem. I would advise leaving it off if you're just trying to fix your power + home button problem.
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5.) If you accidentally tear off the pads on the motherboard at U3, it will be extremely difficult (but not impossible) to repair this defect. You'll have to make a custom microjumper.
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6.) Try not to dislodge the adjacent R20 and R22 during your U3 repair--these are required and seriously small if you knock them off.
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7.) Mis-placement of U3, or if it is dislodged but not completely gone, it will cause the phone to boot in recovery mode and fail to restore--this is another symptom of U3 pry damage. Your phone will not require restoring and will boot up as normal after you replace U3.
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If you'd like more advice, feel free to contact me via my profile.